Publication:
Advances in failure analysis techniques for 3D-technology
Date
| dc.contributor.author | De Wolf, Ingrid | |
| dc.contributor.author | Jacobs, Kristof J.P. | |
| dc.contributor.imecauthor | De Wolf, Ingrid | |
| dc.contributor.imecauthor | Jacobs, Kristof J.P. | |
| dc.contributor.orcidimec | De Wolf, Ingrid::0000-0003-3822-5953 | |
| dc.contributor.orcidimec | Jacobs, Kristof J.P.::0000-0002-1081-3633 | |
| dc.date.accessioned | 2021-10-24T04:01:55Z | |
| dc.date.available | 2021-10-24T04:01:55Z | |
| dc.date.embargo | 9999-12-31 | |
| dc.date.issued | 2017 | |
| dc.identifier.issn | 1526-1344 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/28182 | |
| dc.identifier.url | http://www.chipscalereview.com/issue/1706/ChipScale_May_Jun_2017.pdf | |
| dc.source.beginpage | 21 | |
| dc.source.endpage | 25 | |
| dc.source.issue | 3 | |
| dc.source.journal | Chip Scale Review | |
| dc.source.volume | 21 | |
| dc.title | Advances in failure analysis techniques for 3D-technology | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | Original bundle
| |
| Publication available in collections: |