Publication:
Cost effective 3D-system integration using through-silicon-via technologies
Date
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-16T15:05:17Z | |
| dc.date.available | 2021-10-16T15:05:17Z | |
| dc.date.issued | 2007 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/11738 | |
| dc.source.conference | Semi Technical Symposium,Session 9: Packaging Progressing 3D Jisso Technology, Semicon | |
| dc.source.conferencedate | 5/12/2007 | |
| dc.source.conferencelocation | Chiba Japan | |
| dc.title | Cost effective 3D-system integration using through-silicon-via technologies | |
| dc.type | Oral presentation | |
| dspace.entity.type | Publication | |
| Files | ||
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