Skip to content
Institutional repository
Communities & Collections
Browse
Site
Log In
imec Publications
Conference contributions
Design, fabrication and bumping of test chips for development of fine pitch flip-chip technologies
Publication:
Design, fabrication and bumping of test chips for development of fine pitch flip-chip technologies
Date
1999
Proceedings Paper
Simple item page
Full metadata
Statistics
Loading...
Loading...
Files
3940.pdf
352.63 KB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Vanfleteren, Jan
;
De Baets, Johan
;
Van Calster, Andre
;
Schols, G.
;
Pergoot, N.
;
Järvinen, E.
;
Aintila, A.
Journal
Abstract
Description
Metrics
Downloads
1
since deposited on 2021-10-14
Acq. date: 2025-10-23
Views
1997
since deposited on 2021-10-14
Acq. date: 2025-10-23
Citations
Metrics
Downloads
1
since deposited on 2021-10-14
Acq. date: 2025-10-23
Views
1997
since deposited on 2021-10-14
Acq. date: 2025-10-23
Citations