Publication:
Analytical thermo-mechanical model for non-underfilled area array flip chip assemblies
Date
| dc.contributor.author | Vandevelde, Bart | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.author | Vandepitte, D. | |
| dc.contributor.author | Baelmans, M. | |
| dc.contributor.imecauthor | Vandevelde, Bart | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-15T17:25:55Z | |
| dc.date.available | 2021-10-15T17:25:55Z | |
| dc.date.issued | 2004-09 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/9828 | |
| dc.source.beginpage | 351 | |
| dc.source.endpage | 358 | |
| dc.source.issue | 3 | |
| dc.source.journal | Journal of Electronic Packaging | |
| dc.source.volume | 126 | |
| dc.title | Analytical thermo-mechanical model for non-underfilled area array flip chip assemblies | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
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