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Failure analysis challenges for 3D stacked ICs
Publication:
Failure analysis challenges for 3D stacked ICs
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Date
2014
Meeting abstract
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
De Wolf, Ingrid
;
Phommahaxay, Alain
;
Wang, Teng
;
Linten, Dimitri
;
Guerrieri, Stefano
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1958
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Acq. date: 2025-12-11
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Views
1958
since deposited on 2021-10-22
1
last month
Acq. date: 2025-12-11
Citations