Publication:

Through-Si-Via technology solutions for 3D System Integration

Date

2009
Proceedings Paper
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dc.contributor.authorBeyne, Eric
dc.contributor.authorVan Olmen, Jan
dc.contributor.authorSwinnen, Bart
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.authorJourdain, Anne
dc.contributor.authorLimaye, Paresh
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorVan Olmen, Jan
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorJourdain, Anne
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.date.accessioned2021-10-17T21:23:38Z
dc.date.available2021-10-17T21:23:38Z
dc.date.embargo9999-12-31
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/14996
dc.source.beginpage84
dc.source.conferenceSolid State Devices And Materials Conference - SSDM
dc.source.conferencedate7/10/2009
dc.source.conferencelocationSendai Japan
dc.source.endpage85
dc.title

Through-Si-Via technology solutions for 3D System Integration

dc.typeProceedings paper
dspace.entity.typePublication
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