Fabrication of a shear stress sensor matrix using standard printed circuit board and overmoulding technologies

dc.contributor.author	Monte, Ann
dc.contributor.author	Daems, Jef
dc.contributor.author	Missinne, Jeroen
dc.contributor.imecauthor	Missinne, Jeroen
dc.contributor.orcidimec	Missinne, Jeroen::0000-0002-3470-620X
dc.date.accessioned	2021-10-29T00:59:55Z
dc.date.available	2021-10-29T00:59:55Z
dc.date.embargo	9999-12-31
dc.date.issued	2020
dc.identifier.issn	2156-3950
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/35605
dc.identifier.url	https://ieeexplore.ieee.org/document/8970323
dc.source.beginpage	479
dc.source.endpage	486
dc.source.issue	3
dc.source.journal	IEEE Transactions on Components, Packaging and Manufacturing Technology
dc.source.volume	10
dc.title	Fabrication of a shear stress sensor matrix using standard printed circuit board and overmoulding technologies
dc.type	Journal article
dspace.entity.type	Publication
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