Publication:

Reduction of the premetal dielectric thermal budget for a 0.35 μm technology

Date

1996
Proceedings Paper
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dc.contributor.authorWaeterloos, Joost
dc.contributor.authorMeynen, Herman
dc.contributor.authorde Potter de ten Broeck, Muriel
dc.contributor.authorCoenegrachts, Bart
dc.contributor.authorGao, Teng
dc.contributor.authorGrillaert, Joost
dc.contributor.authorVan den hove, Luc
dc.contributor.authorMaex, Karen
dc.contributor.imecauthorde Potter de ten Broeck, Muriel
dc.contributor.imecauthorCoenegrachts, Bart
dc.contributor.imecauthorVan den hove, Luc
dc.contributor.imecauthorMaex, Karen
dc.date.accessioned2021-09-29T15:51:02Z
dc.date.available2021-09-29T15:51:02Z
dc.date.embargo9999-12-31
dc.date.issued1996
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/1645
dc.source.beginpage55
dc.source.conferenceProceedings of the 13th International VLSI Multilevel Interconnection Conference - VMIC
dc.source.conferencedate18/06/1996
dc.source.conferencelocationSanta Clara, CA USA
dc.source.endpage57
dc.title

Reduction of the premetal dielectric thermal budget for a 0.35 μm technology

dc.typeProceedings paper
dspace.entity.typePublication
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