Publication:
ESD consideration on 3D stacking integrated circuits constructed with through-silicon-via (TSV) and micro-bump structures
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1765 since deposited on 2021-10-20
2last month
Acq. date: 2025-12-15
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Metrics
Views
1765 since deposited on 2021-10-20
2last month
Acq. date: 2025-12-15
Citations