Publication:
The 3-D interconnect technology landscape
Date
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-23T10:06:58Z | |
| dc.date.available | 2021-10-23T10:06:58Z | |
| dc.date.embargo | 9999-12-31 | |
| dc.date.issued | 2016 | |
| dc.identifier.issn | 2168-2355 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/26337 | |
| dc.identifier.url | https://ieeexplore.ieee.org/document/7438817 | |
| dc.source.beginpage | 8 | |
| dc.source.endpage | 20 | |
| dc.source.issue | 3 | |
| dc.source.journal | IEEE Design & Test | |
| dc.source.volume | 33 | |
| dc.title | The 3-D interconnect technology landscape | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | Original bundle
| |
| Publication available in collections: |