Publication:

Development of B-spline x-ray diffraction imaging techniques for die warpage and stress monitoring inside fully encapsulated packaged chips

Date

2014
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorWong, C.S.
dc.contributor.authorIvankovic, Andrej
dc.contributor.authorCowley, A.
dc.contributor.authorBennett, N.S.
dc.contributor.authorDanilewsky, A.
dc.contributor.authorGonzalez, Mario
dc.contributor.authorCherman, Vladimir
dc.contributor.authorVandevelde, Bart
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorMcNally, P.J.
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.accessioned2021-10-22T08:23:28Z
dc.date.available2021-10-22T08:23:28Z
dc.date.embargo9999-12-31
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24829
dc.identifier.urlhttp://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6897495&tag=1
dc.source.beginpage1517
dc.source.conferenceIEEE 64th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate27/05/2014
dc.source.conferencelocationLake Buena Vista, FL USA
dc.source.endpage1522
dc.title

Development of B-spline x-ray diffraction imaging techniques for die warpage and stress monitoring inside fully encapsulated packaged chips

dc.typeProceedings paper
dspace.entity.typePublication
Files

Original bundle

Name:
27925.pdf
Size:
2.8 MB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Conference contributions