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Impact of the barrier/dielectric interface quality on reliability of Cu porous-low-k interconnects
Publication:
Impact of the barrier/dielectric interface quality on reliability of Cu porous-low-k interconnects
Date
2004
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Tokei, Zsolt
;
Sutcliffe, Victor
;
Demuynck, Steven
;
Iacopi, Francesca
;
Roussel, Philippe
;
Beyer, Gerald
;
Hoofman, Romano
;
Maex, Karen
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1930
since deposited on 2021-10-15
Acq. date: 2025-10-23
Citations
Metrics
Views
1930
since deposited on 2021-10-15
Acq. date: 2025-10-23
Citations