Publication:
Process Development and Characterization of Ru-based UBM for In Bumps Integration for Quantum Computing Applications
| dc.contributor.author | Le Tulzo, Harold | |
| dc.contributor.author | Bijou, Diane | |
| dc.contributor.author | Souza, Therese | |
| dc.contributor.author | Gallegos, Anthony | |
| dc.contributor.author | Thomas, Candice | |
| dc.contributor.author | Deschaseaux, Edouard | |
| dc.contributor.author | Feautrier, Celine | |
| dc.contributor.author | Charbonnier, Jean | |
| dc.contributor.author | Gueugnot, Alain | |
| dc.contributor.author | Derakhshandeh, Jaber | |
| dc.contributor.author | Hussain, Tassawar | |
| dc.contributor.author | Daviot, Jerome | |
| dc.contributor.imecauthor | Derakhshandeh, Jaber | |
| dc.contributor.imecauthor | Hussain, Tassawar | |
| dc.contributor.orcidimec | Derakhshandeh, Jaber::0000-0003-2448-9165 | |
| dc.contributor.orcidimec | Hussain, Tassawar::0000-0002-8916-7135 | |
| dc.date.accessioned | 2025-07-31T09:13:38Z | |
| dc.date.available | 2024-12-07T16:57:02Z | |
| dc.date.available | 2025-07-31T09:13:38Z | |
| dc.date.issued | 2024 | |
| dc.description.wosFundingText | This project leading to this application has received funding from the ECSEL Joint Undertaking (JU) under grant agreement No 101007322. The JU receives support from the European Union's Horizon 2020 research and innovation program and Germany, France, Belgium, Austria, Netherlands, Finland, Israel. (Please visit the project website www.matqu.eu for more information). The authors would also like to thank Fabrice Tanic, Tofana Costa, and Tasnime Laib for their dedication to experimental work and all Technic team for fruitful discussions. | |
| dc.identifier.doi | 10.1109/ECTC51529.2024.00068 | |
| dc.identifier.eisbn | 979-8-3503-7598-5 | |
| dc.identifier.isbn | 979-8-3503-7599-2 | |
| dc.identifier.issn | 0569-5503 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/44936 | |
| dc.publisher | IEEE COMPUTER SOC | |
| dc.source.beginpage | 378 | |
| dc.source.conference | IEEE 74th Electronic Components and Technology Conference (ECTC) | |
| dc.source.conferencedate | MAY 28-31, 2024 | |
| dc.source.conferencelocation | Denver | |
| dc.source.endpage | 385 | |
| dc.source.journal | N/A | |
| dc.source.numberofpages | 8 | |
| dc.subject.keywords | WET ETCH | |
| dc.subject.keywords | PERIODATE | |
| dc.title | Process Development and Characterization of Ru-based UBM for In Bumps Integration for Quantum Computing Applications | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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