Publication:

A novel intermetallic compound insertion bonding to improve throughput for 3D die to wafer stacking

Date

2020
Proceedings Paper
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dc.contributor.authorHou, Lin
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorCapuz, Giovanni
dc.contributor.authorLofrano, Melina
dc.contributor.authorBeyne, Eric
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.imecauthorHou, Lin
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorCapuz, Giovanni
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecCapuz, Giovanni::0000-0002-5263-4836
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.accessioned2021-10-28T22:38:20Z
dc.date.available2021-10-28T22:38:20Z
dc.date.issued2020
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/35285
dc.identifier.urlhttps://ieeexplore.ieee.org/document/9159326
dc.source.conference2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
dc.source.conferencedate26/05/2020
dc.source.conferencelocationonline online
dc.title

A novel intermetallic compound insertion bonding to improve throughput for 3D die to wafer stacking

dc.typeProceedings paper
dspace.entity.typePublication
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