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Cost-effectiveness of wafer-to-wafer 3D chip stacking with matching pre-tested wafers
Publication:
Cost-effectiveness of wafer-to-wafer 3D chip stacking with matching pre-tested wafers
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Date
2010
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20048.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Verbree, Jouke
;
Marinissen, Erik Jan
;
Roussel, Philippe
;
Velenis, Dimitrios
Journal
Abstract
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Acq. date: 2025-12-14
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Metrics
Views
1921
since deposited on 2021-10-18
3
last month
Acq. date: 2025-12-14
Citations