Publication:

High efficiency direct liquid jet impingement cooling of high power devices using a 3D-shaped polymer cooler

Date

 
dc.contributor.authorWei, Tiwei
dc.contributor.authorOprins, Herman
dc.contributor.authorCherman, Vladimir
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorBeyne, Eric
dc.contributor.authorBaelmans, Martine
dc.contributor.imecauthorWei, Tiwei
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-24T18:46:35Z
dc.date.available2021-10-24T18:46:35Z
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/29919
dc.source.beginpage733
dc.source.conferenceIEEE International Electron Devices Meeting - IEDM
dc.source.conferencedate2/12/2017
dc.source.conferencelocationSan Francisco, CA USA
dc.source.endpage736
dc.title

High efficiency direct liquid jet impingement cooling of high power devices using a 3D-shaped polymer cooler

dc.typeProceedings paper
dspace.entity.typePublication
Files
Publication available in collections: