Publication:

Kinetic defect distribution approach for modeling the transient, endurance and retention of a-VMCO RRAM

Date

 
dc.contributor.authorSubhechha, Subhali
dc.contributor.authorDegraeve, Robin
dc.contributor.authorRoussel, Philippe
dc.contributor.authorGoux, Ludovic
dc.contributor.authorClima, Sergiu
dc.contributor.authorDe Meyer, Kristin
dc.contributor.authorVan Houdt, Jan
dc.contributor.authorKar, Gouri Sankar
dc.contributor.imecauthorSubhechha, Subhali
dc.contributor.imecauthorDegraeve, Robin
dc.contributor.imecauthorRoussel, Philippe
dc.contributor.imecauthorGoux, Ludovic
dc.contributor.imecauthorClima, Sergiu
dc.contributor.imecauthorDe Meyer, Kristin
dc.contributor.imecauthorVan Houdt, Jan
dc.contributor.imecauthorKar, Gouri Sankar
dc.contributor.orcidimecRoussel, Philippe::0000-0002-0402-8225
dc.contributor.orcidimecGoux, Ludovic::0000-0002-1276-2278
dc.contributor.orcidimecClima, Sergiu::0000-0002-4044-9975
dc.contributor.orcidimecVan Houdt, Jan::0000-0003-1381-6925
dc.date.accessioned2021-10-24T14:22:43Z
dc.date.available2021-10-24T14:22:43Z
dc.date.embargo9999-12-31
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/29517
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7936322/
dc.source.beginpage5A-5.1
dc.source.conferenceIEEE International Reliability Physics Symposium - IRPS
dc.source.conferencedate2/04/2017
dc.source.conferencelocationMonterey, CA USA
dc.source.endpage5A-5.6
dc.title

Kinetic defect distribution approach for modeling the transient, endurance and retention of a-VMCO RRAM

dc.typeProceedings paper
dspace.entity.typePublication
Files

Original bundle

Name:
34845.pdf
Size:
1.47 MB
Format:
Adobe Portable Document Format
Publication available in collections: