Publication:
Flip chip on flex versus on PCB: impact on thermal management
Date
| dc.contributor.author | Vandevelde, Bart | |
| dc.contributor.imecauthor | Vandevelde, Bart | |
| dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
| dc.date.accessioned | 2021-10-16T06:36:53Z | |
| dc.date.available | 2021-10-16T06:36:53Z | |
| dc.date.issued | 2005-11 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/11473 | |
| dc.source.beginpage | 1 | |
| dc.source.conference | Be-Flexible Workshop | |
| dc.source.conferencedate | 23/11/2005 | |
| dc.source.conferencelocation | München Germany | |
| dc.source.endpage | 6 | |
| dc.title | Flip chip on flex versus on PCB: impact on thermal management | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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