Reliability of different flex materials in high density flip chip on flex applications

dc.contributor.author	Palm, P.
dc.contributor.author	Määttänen, J.
dc.contributor.author	De Maquillé, Y.
dc.contributor.author	Picault, A.
dc.contributor.author	Vanfleteren, Jan
dc.contributor.author	Vandecasteele, Bjorn
dc.contributor.imecauthor	Vanfleteren, Jan
dc.contributor.imecauthor	Vandecasteele, Bjorn
dc.contributor.orcidimec	Vanfleteren, Jan::0000-0002-9654-7304
dc.date.accessioned	2021-10-14T17:33:24Z
dc.date.available	2021-10-14T17:33:24Z
dc.date.issued	2001
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/5560
dc.source.beginpage	224
dc.source.conference	Proceedings of the first International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics - Polytronic
dc.source.conferencedate	21/10/2001
dc.source.conferencelocation	Potsdam
dc.source.endpage	229
dc.title	Reliability of different flex materials in high density flip chip on flex applications
dc.type	Proceedings paper
dspace.entity.type	Publication
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