Publication:

Reliability Study of Polymers Used in Sub-4-mu m Pitch RDL Applications

Date

2021
Journal article
https://doi.org/10.1109/TCPMT.2021.3079515
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dc.contributor.authorChery, Emmanuel
dc.contributor.authorDuval, Fabrice
dc.contributor.authorStucchi, Michele
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorCroes, Kristof
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorChery, Emmanuel
dc.contributor.imecauthorDuval, Fabrice F. C.
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDuval, Fabrice
dc.contributor.orcidimecDuval, Fabrice F. C.::0000-0001-7652-6402
dc.contributor.orcidimecStucchi, Michele::0000-0002-7848-0492
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecChery, Emmanuel::0000-0002-2526-3873
dc.date.accessioned2022-02-22T10:50:45Z
dc.date.available2022-02-22T10:50:45Z
dc.date.issued2021
dc.identifier.doi10.1109/TCPMT.2021.3079515
dc.identifier.issn2156-3950
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/38989
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
dc.source.beginpage1073
dc.source.endpage1080
dc.source.issue7
dc.source.journalIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
dc.source.numberofpages8
dc.source.volume11
dc.subject.keywordsCU THIN-FILMS
dc.subject.keywordsLOW-TEMPERATURE
dc.subject.keywordsOXIDATION
dc.subject.keywordsWATER
dc.subject.keywordsPERMITTIVITY
dc.subject.keywordsRESISTIVITY
dc.subject.keywordsKINETICS
dc.title

Reliability Study of Polymers Used in Sub-4-mu m Pitch RDL Applications

dc.typeJournal article
dspace.entity.typePublication
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