Publication:

Integrating Deep and Shallow Models for Multi-Modal Depression Analysis-Hybrid Architectures

Date

2021
Journal article
https://doi.org/10.1109/TAFFC.2018.2870398
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dc.contributor.authorYang, Le
dc.contributor.authorJiang, Dongmei
dc.contributor.authorSahli, Hichem
dc.contributor.imecauthorSahli, Hichem
dc.contributor.orcidextJiang, Dongmei::0000-0002-6238-8499
dc.date.accessioned2022-02-24T15:24:59Z
dc.date.available2022-02-24T15:24:59Z
dc.date.issued2021
dc.identifier.doi10.1109/TAFFC.2018.2870398
dc.identifier.issn1949-3045
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/39117
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
dc.source.beginpage239
dc.source.endpage253
dc.source.issue1
dc.source.journalIEEE TRANSACTIONS ON AFFECTIVE COMPUTING
dc.source.numberofpages15
dc.source.volume12
dc.title

Integrating Deep and Shallow Models for Multi-Modal Depression Analysis-Hybrid Architectures

dc.typeJournal article
dspace.entity.typePublication
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