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Recent progress in heterogeneous integration on the silicon nitride platform using micro-transfer printing

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cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0002-0790-5190
cris.virtual.orcid0000-0002-4667-5092
cris.virtual.orcid0000-0001-9586-8424
cris.virtual.orcid#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0003-4692-9467
cris.virtual.orcid0000-0002-5784-5050
cris.virtual.orcid0000-0002-5223-5480
cris.virtual.orcid0000-0002-0943-9779
cris.virtual.orcid#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0002-8374-1466
cris.virtual.orcid0000-0002-5639-9300
cris.virtual.orcid0000-0002-9795-6564
cris.virtual.orcid0000-0002-8745-7833
cris.virtualsource.department37100c79-97ff-4c90-8a44-4ebc848be45d
cris.virtualsource.departmentb32be2a6-49e5-4859-8aac-84fd4f5bec8e
cris.virtualsource.department435d309d-6c96-4aab-89d4-959fcbbd141c
cris.virtualsource.departmentde56cf5d-bb1c-4f9f-a184-208760c36236
cris.virtualsource.department8c9a9d17-51d2-44fa-bc9b-2e95ee36cede
cris.virtualsource.department377ec1c2-b35a-4ae7-97d0-617df102d0c5
cris.virtualsource.department89d7c8db-af3e-49da-9cb5-6bb50bb12acc
cris.virtualsource.departmentcc455c2b-f28f-4dea-a673-038f0f085cdf
cris.virtualsource.department8f0b1040-898b-4cb3-8181-8f6284d3b3ac
cris.virtualsource.department50d9a3a0-bb42-4aef-ac01-6bd52d441e5f
cris.virtualsource.departmenteb6f7727-278e-4dc4-8e38-517dc3f5c61a
cris.virtualsource.departmentd07175ef-8b30-4aea-a04e-ffafc605dae6
cris.virtualsource.department8702e98e-0020-4bac-92bf-bf86ed6629f8
cris.virtualsource.departmentddf75a08-5f04-4872-9823-2c85f1f2db8c
cris.virtualsource.orcid37100c79-97ff-4c90-8a44-4ebc848be45d
cris.virtualsource.orcidb32be2a6-49e5-4859-8aac-84fd4f5bec8e
cris.virtualsource.orcid435d309d-6c96-4aab-89d4-959fcbbd141c
cris.virtualsource.orcidde56cf5d-bb1c-4f9f-a184-208760c36236
cris.virtualsource.orcid8c9a9d17-51d2-44fa-bc9b-2e95ee36cede
cris.virtualsource.orcid377ec1c2-b35a-4ae7-97d0-617df102d0c5
cris.virtualsource.orcid89d7c8db-af3e-49da-9cb5-6bb50bb12acc
cris.virtualsource.orcidcc455c2b-f28f-4dea-a673-038f0f085cdf
cris.virtualsource.orcid8f0b1040-898b-4cb3-8181-8f6284d3b3ac
cris.virtualsource.orcid50d9a3a0-bb42-4aef-ac01-6bd52d441e5f
cris.virtualsource.orcideb6f7727-278e-4dc4-8e38-517dc3f5c61a
cris.virtualsource.orcidd07175ef-8b30-4aea-a04e-ffafc605dae6
cris.virtualsource.orcid8702e98e-0020-4bac-92bf-bf86ed6629f8
cris.virtualsource.orcidddf75a08-5f04-4872-9823-2c85f1f2db8c
dc.contributor.authorBillet, Maximilien
dc.contributor.authorVanackere, Tom
dc.contributor.authorVandekerckhove, Tom
dc.contributor.authorNiels, Margot
dc.contributor.authorReis, Luis
dc.contributor.authorMaes, Dennis
dc.contributor.authorKiewiet, Max
dc.contributor.authorAkritidis, Konstantinos
dc.contributor.authorCuyvers, Stijn
dc.contributor.authorPoelman, Stijn
dc.contributor.authorReep, Tom
dc.contributor.authorBonito Oliva, Valeria
dc.contributor.authorLeo, Francois
dc.contributor.authorRoelkens, Gunther
dc.contributor.authorKuyken, Bart
dc.date.accessioned2026-01-19T15:31:55Z
dc.date.available2026-01-19T15:31:55Z
dc.date.issued2024
dc.description.abstractPhotonic integrated circuits enable the miniaturization of photonic systems by integrating key optical functions on a chip. While CMOS compatible silicon and silicon nitride are very efficient platforms for passive circuits, they lack active key functionalities for the realization of a full system on a chip. A versatile solution is to use micro-transfer printing for heterogeneous integration of active devices on such platforms. Here we present the recent advances of micro-transfer printing on silicon nitride and discuss the remaining challenges.
dc.identifier10.1117/12.2691017
dc.identifier.doi10.1117/12.2691017
dc.identifier.isbn978-1-5106-7043-3
dc.identifier.issn0277-786X
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/58670
dc.language.isoen
dc.provenance.editstepusergreet.vanhoof@imec.be
dc.publisherSPIE
dc.relation.ispartofSILICON PHOTONICS XIX
dc.relation.ispartofseriesSILICON PHOTONICS XIX
dc.source.beginpage128910B
dc.source.conferenceSilicon Photonics XIX
dc.source.conferencedate2024-01-29
dc.source.conferencelocationSan Francisco
dc.source.journalProceedings of SPIE
dc.subjectHeterogenous integration
dc.subjectTransfer printing
dc.subjectSilicon nitride
dc.subjectSilicon photonics
dc.subjectIII-V
dc.subjectLithium niobate
dc.subjectScience & Technology
dc.subjectTechnology
dc.subjectPhysical Sciences
dc.title

Recent progress in heterogeneous integration on the silicon nitride platform using micro-transfer printing

dc.typeProceedings paper
dspace.entity.typePublication
oaire.citation.editionWOS.ISTP
oaire.citation.volume12891
person.identifier.ridAFB-1170-2022
person.identifier.ridO-9943-2016
person.identifier.ridADG-0941-2022
person.identifier.ridNXX-8254-2025
person.identifier.ridISA-8554-2023
person.identifier.ridLCE-0261-2024
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