Publication:

Process complexity and cost considerations of multi-layer die stacks

Date

2019
Proceedings Paper
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dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorKim, Soon-Wook
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorBex, Pieter
dc.contributor.authorCapuz, Giovanni
dc.contributor.authorSuhard, Samuel
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorMarinissen, Erik Jan
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorKim, Soon-Wook
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorCapuz, Giovanni
dc.contributor.imecauthorSuhard, Samuel
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecCapuz, Giovanni::0000-0002-5263-4836
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-27T22:14:05Z
dc.date.available2021-10-27T22:14:05Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/34340
dc.identifier.urlhttps://3dic-conf.org/wp-content/uploads/2019/09/3DIC_Program_Schedule_20190904.pdf
dc.source.conference3DIC 2018
dc.source.conferencedate8/10/2019
dc.source.conferencelocationSendai Japan
dc.title

Process complexity and cost considerations of multi-layer die stacks

dc.typeProceedings paper
dspace.entity.typePublication
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