Publication:
Fabrication and transport properties of ultra-fine copper interconnects
Date
| dc.contributor.author | Wu, Wen | |
| dc.contributor.thesisadvisor | Maex, Karen | |
| dc.date.accessioned | 2021-10-15T18:01:09Z | |
| dc.date.available | 2021-10-15T18:01:09Z | |
| dc.date.embargo | 9999-12-31 | |
| dc.date.issued | 2004-09 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/9936 | |
| dc.title | Fabrication and transport properties of ultra-fine copper interconnects | |
| dc.type | PHD thesis | |
| dspace.entity.type | Publication | |
| Files | Original bundle
| |
| Publication available in collections: |