Publication:

Through-Si via (TSV) technology – weighting the technology and costs

Date

2009
Journal article
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dc.contributor.authorProvoost, Jan
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorProvoost, Jan
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-18T01:58:01Z
dc.date.available2021-10-18T01:58:01Z
dc.date.embargo9999-12-31
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16061
dc.identifier.urlhttp://mag.sichinamag.com/Show/200907
dc.source.beginpage36
dc.source.endpage38
dc.source.issue6
dc.source.journalSemiconductor International China
dc.title

Through-Si via (TSV) technology – weighting the technology and costs

dc.typeJournal article
dspace.entity.typePublication
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