Publication:

A framework for combined simulations of electromigration induced stress evolution, void nucleation, and its dynamics: Application to nano-interconnect reliability

Date

2023
Journal article
https://doi.org/10.1063/5.0165949
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dc.contributor.authorSaleh, Ahmed
dc.contributor.authorCroes, Kristof
dc.contributor.authorCeric, H.
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorZahedmanesh, Houman
dc.contributor.imecauthorSaleh, Ahmed
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorZahedmanesh, Houman
dc.contributor.orcidimecSaleh, Ahmed::0000-0002-2663-1922
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecZahedmanesh, Houman::0000-0002-0290-691X
dc.date.accessioned2023-11-28T09:17:10Z
dc.date.available2023-11-12T17:45:37Z
dc.date.available2023-11-28T09:17:10Z
dc.date.issued2023
dc.identifier.doi10.1063/5.0165949
dc.identifier.issn0021-8979
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/43138
dc.publisherAIP Publishing
dc.source.beginpageArt. 135102
dc.source.endpagena
dc.source.issue13
dc.source.journalJOURNAL OF APPLIED PHYSICS
dc.source.numberofpages12
dc.source.volume134
dc.subject.keywordsMECHANICAL-STRESS
dc.subject.keywordsMODEL
dc.subject.keywordsLINES
dc.subject.keywordsFAILURE
dc.subject.keywordsCOPPER
dc.subject.keywordsGROWTH
dc.title

A framework for combined simulations of electromigration induced stress evolution, void nucleation, and its dynamics: Application to nano-interconnect reliability

dc.typeJournal article
dspace.entity.typePublication
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