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Optimization methods for post-bond die-internal/external testing in 3D stacked ICs
Publication:
Optimization methods for post-bond die-internal/external testing in 3D stacked ICs
Date
2010-10
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Noia, Brandon
;
Chakrabarty, Krishnendu
;
Marinissen, Erik Jan
Journal
Abstract
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1914
since deposited on 2021-10-18
Acq. date: 2025-10-24
Citations
Metrics
Views
1914
since deposited on 2021-10-18
Acq. date: 2025-10-24
Citations