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Presentations
Flip-chip redistribution using stencilprinted bumps
Publication:
Flip-chip redistribution using stencilprinted bumps
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Date
1999
Presentation
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3182.pdf
713.32 KB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Beerten, Steven
;
Beyne, Eric
;
Honoré, Mia
;
Van Hoof, Rita
;
Wojciechowski, Dominique
;
Truzzi, Claudio
Journal
Abstract
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2008
since deposited on 2021-10-06
Acq. date: 2025-12-10
Citations
Metrics
Views
2008
since deposited on 2021-10-06
Acq. date: 2025-12-10
Citations