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Conference contributions
The PSGA, a lead-free CSP for high performance and high reliable packaging
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The PSGA, a lead-free CSP for high performance and high reliable packaging
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Date
2001
Proceedings Paper
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Vandevelde, Bart
;
Chandrasekhar, Arun
;
Driessens, Evelien
;
Beyne, Eric
;
Van Puymbroeck, Jef
;
Heerman, M.
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1973
since deposited on 2021-10-14
1
last month
Acq. date: 2025-12-10
Citations
Metrics
Views
1973
since deposited on 2021-10-14
1
last month
Acq. date: 2025-12-10
Citations