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The PSGA, a lead-free CSP for high performance and high reliable packaging
Publication:
The PSGA, a lead-free CSP for high performance and high reliable packaging
Date
2001
Proceedings Paper
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5819.pdf
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Vandevelde, Bart
;
Chandrasekhar, Arun
;
Driessens, Evelien
;
Beyne, Eric
;
Van Puymbroeck, Jef
;
Heerman, M.
Journal
Abstract
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1971
since deposited on 2021-10-14
Acq. date: 2025-10-26
Citations
Metrics
Views
1971
since deposited on 2021-10-14
Acq. date: 2025-10-26
Citations