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Through-pellicle-capable DUV-based CD metrology on reticles for wafer fab and R&D environment
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Through-pellicle-capable DUV-based CD metrology on reticles for wafer fab and R&D environment
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Date
2003-01
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Jonckheere, Rik
;
Philipsen, Vicky
;
Scheuring, Gerd
;
Hillman, Frank
;
Brueck, Hans-Juergen
;
Ordynskyy, Volodymyr
;
Peter, Kai
;
Hourd, Andrew
;
Schaetz, Thomas
;
Chen, Shiuh-Bin
;
Chen, Parkson
;
Sommer, Karl
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1833
since deposited on 2021-10-15
Acq. date: 2025-12-15
Citations
Metrics
Views
1833
since deposited on 2021-10-15
Acq. date: 2025-12-15
Citations