Publication:
Innovative component positioning method for thermoformed electronics
| dc.contributor.author | Madadnia, Behnam | |
| dc.contributor.author | Bossuyt, Frederick | |
| dc.contributor.author | Vanfleteren, Jan | |
| dc.contributor.imecauthor | Madadnia, Behnam | |
| dc.contributor.imecauthor | Bossuyt, Frederick | |
| dc.contributor.imecauthor | Vanfleteren, Jan | |
| dc.contributor.orcidimec | Bossuyt, Frederick::0000-0003-3350-9295 | |
| dc.contributor.orcidimec | Vanfleteren, Jan::0000-0002-9654-7304 | |
| dc.date.accessioned | 2023-04-06T13:15:48Z | |
| dc.date.available | 2022-10-31T02:58:28Z | |
| dc.date.available | 2023-04-06T13:15:48Z | |
| dc.date.issued | 2022 | |
| dc.description.wosFundingText | Osterreichische forschungsforderungsgesellschaft (Grant No. 871495) | |
| dc.identifier.doi | 10.1088/2058-8585/ac9989 | |
| dc.identifier.issn | 2058-8585 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/40659 | |
| dc.publisher | IOP Publishing Ltd | |
| dc.source.beginpage | Art. 045006 | |
| dc.source.endpage | na | |
| dc.source.issue | 4 | |
| dc.source.journal | FLEXIBLE AND PRINTED ELECTRONICS | |
| dc.source.numberofpages | 11 | |
| dc.source.volume | 7 | |
| dc.subject.keywords | INTERCONNECTS | |
| dc.subject.keywords | DESIGN | |
| dc.title | Innovative component positioning method for thermoformed electronics | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
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