Publication:

Impact of wafer thinning on front-end reliability for 3D integration

Date

2016
Proceedings Paper
Simple item page Full metadata Statistics
Loading...
Thumbnail Image

Files

32562.pdf 982.11 KB

Author(s)

Vaisman Chasin, Adrian  
;
Scholz, Mirko
;
Guo, Wei  
;
Franco, Jacopo  
;
Potoms, Goedele  
;
Jourdain, Anne  
;
Linten, Dimitri  
;
Van der Plas, Geert  
;
Absil, Philippe  
;
Beyne, Eric  

Journal

Abstract

Description

Statistics

Views

1916 since deposited on 2021-10-23
2last month
Acq. date: 2026-09-15

Citations

Statistics

Views

1916 since deposited on 2021-10-23
2last month
Acq. date: 2026-09-15

Citations