Publication:

Recent Progress and Challenges Regarding Carbon Nanotube On-Chip Interconnects

Date

2022
Journal Article Review
https://doi.org/10.3390/mi13071148
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dc.contributor.authorXu, Baohui
dc.contributor.authorChen, Rongmei
dc.contributor.authorZhou, Jiuren
dc.contributor.authorLiang, Jie
dc.contributor.imecauthorChen, Rongmei
dc.date.accessioned2022-12-13T10:38:37Z
dc.date.available2022-08-07T02:38:52Z
dc.date.available2022-12-13T10:38:37Z
dc.date.issued2022
dc.description.wosFundingTextThis research was funded by the National Natural Science Foundation of China (grant number 62104138).
dc.identifier.doi10.3390/mi13071148
dc.identifier.issn2072-666X
dc.identifier.pmidMEDLINE:35888965
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/40218
dc.publisherMDPI
dc.source.beginpage1148
dc.source.endpagena
dc.source.issue7
dc.source.journalMICROMACHINES
dc.source.numberofpages19
dc.source.volume13
dc.subject.keywordsPERFORMANCE ANALYSIS
dc.subject.keywordsTHERMAL-CONDUCTIVITY
dc.subject.keywordsGLOBAL INTERCONNECTS
dc.subject.keywordsREPEATER INSERTION
dc.subject.keywordsTHROUGH-SILICON
dc.subject.keywordsRESISTANCE
dc.subject.keywordsBUNDLES
dc.subject.keywordsDESIGN
dc.subject.keywordsDELAY
dc.subject.keywordsFABRICATION
dc.title

Recent Progress and Challenges Regarding Carbon Nanotube On-Chip Interconnects

dc.typeJournal article review
dspace.entity.typePublication
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