Publication:
Multilayer thin film technology with integrated passive components: enabling technology for microwave "systems-in-a-package" integration
Date
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-14T16:37:29Z | |
| dc.date.available | 2021-10-14T16:37:29Z | |
| dc.date.issued | 2001 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/5063 | |
| dc.source.conference | Mesago Conference, System Integration in Microelectronics; April 25, 2001; Nuremberg, Germany. | |
| dc.source.conferencelocation | ||
| dc.title | Multilayer thin film technology with integrated passive components: enabling technology for microwave "systems-in-a-package" integration | |
| dc.type | Oral presentation | |
| dspace.entity.type | Publication | |
| Files | ||
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