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Articles
3D Packaging issues for ultrasmall systems-in-a-cube
Publication:
3D Packaging issues for ultrasmall systems-in-a-cube
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Date
2005-04
Journal article
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Snoeckx, Koen
;
De Moor, Piet
;
De Munck, Koen
;
Beyne, Eric
Journal
Solid State Technology
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1993
since deposited on 2021-10-16
1
last month
Acq. date: 2025-12-15
Citations
Metrics
Views
1993
since deposited on 2021-10-16
1
last month
Acq. date: 2025-12-15
Citations