Publication:
Moisture induced failures in flip chip on flex interconnections using anisotropic conductive adhesives
Date
| dc.contributor.author | Caers, J.F.J.M. | |
| dc.contributor.author | Zhao, X.J. | |
| dc.contributor.author | Lekens, Geert | |
| dc.contributor.author | Dreesen, R. | |
| dc.contributor.author | Croes, K. | |
| dc.contributor.author | Wong, E.H. | |
| dc.contributor.imecauthor | Lekens, Geert | |
| dc.date.accessioned | 2021-10-15T04:04:54Z | |
| dc.date.available | 2021-10-15T04:04:54Z | |
| dc.date.issued | 2003 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/7268 | |
| dc.source.conference | Proceedings of the Business of Electronic Product Reliability and Reliability | |
| dc.source.conferencedate | 13/01/2003 | |
| dc.source.conferencelocation | Hong-Kong | |
| dc.title | Moisture induced failures in flip chip on flex interconnections using anisotropic conductive adhesives | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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