Publication:
Corrosion inhibition by thiol-derived SAMs for enhanced wire bonding on Cu surfaces
Date
| dc.contributor.author | Whelan, Caroline | |
| dc.contributor.author | Kinsella, Michael | |
| dc.contributor.author | Hong, Meng Ho | |
| dc.contributor.author | Maex, Karen | |
| dc.contributor.imecauthor | Maex, Karen | |
| dc.date.accessioned | 2021-10-15T17:54:10Z | |
| dc.date.available | 2021-10-15T17:54:10Z | |
| dc.date.issued | 2004 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/9915 | |
| dc.source.beginpage | B33 | |
| dc.source.endpage | B38 | |
| dc.source.issue | 2 | |
| dc.source.journal | J. Electrochem. Soc. | |
| dc.source.volume | 151 | |
| dc.title | Corrosion inhibition by thiol-derived SAMs for enhanced wire bonding on Cu surfaces | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
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