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Conference contributions
Reliability analysis of Cu contacts with various diffusion barriers
Publication:
Reliability analysis of Cu contacts with various diffusion barriers
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Date
2008
Meeting abstract
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16863.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Kauerauf, Thomas
;
Demuynck, Steven
;
Tokei, Zsolt
;
Croes, Kristof
;
Beyer, Gerald
;
Groeseneken, Guido
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1854
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Acq. date: 2025-12-15
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Views
1854
since deposited on 2021-10-17
3
last month
Acq. date: 2025-12-15
Citations