Publication:
Parameter study for the reliability of underfilled flip chip and CSP assemblies
Date
| dc.contributor.author | Vandevelde, Bart | |
| dc.contributor.author | Degryse, Dominiek | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.author | Vandepitte, D. | |
| dc.contributor.author | Baelmans, M. | |
| dc.contributor.imecauthor | Vandevelde, Bart | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-14T23:47:20Z | |
| dc.date.available | 2021-10-14T23:47:20Z | |
| dc.date.issued | 2002 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/6994 | |
| dc.source.beginpage | 130 | |
| dc.source.conference | Proceedings of the European Microelectronics Packaging and Interconnection Symposium - IMAPS-EUROPE | |
| dc.source.conferencedate | 14/06/2002 | |
| dc.source.conferencelocation | Cracow Poland | |
| dc.source.endpage | 135 | |
| dc.title | Parameter study for the reliability of underfilled flip chip and CSP assemblies | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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