Force constants for liquid solder bumps with unequal pad sizes

dc.contributor.author	Van Veen, C.
dc.contributor.author	Vandevelde, Bart
dc.contributor.imecauthor	Vandevelde, Bart
dc.contributor.orcidimec	Vandevelde, Bart::0000-0002-6753-6438
dc.date.accessioned	2021-10-14T18:08:50Z
dc.date.available	2021-10-14T18:08:50Z
dc.date.issued	2001
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/5759
dc.source.beginpage	249
dc.source.conference	Proceedings of the 2nd Eurosime Conference; 9-11 April 2001; Paris, France.
dc.source.conferencelocation
dc.source.endpage	254
dc.title	Force constants for liquid solder bumps with unequal pad sizes
dc.type	Proceedings paper
dspace.entity.type	Publication
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