Publication:
Deformation analysis of QFN packages for validation of thermo-mechanical finite element simulations
| dc.contributor.author | Nawghane, Chinmay | |
| dc.contributor.author | Moncond'huy, Thomas | |
| dc.contributor.author | Vandevelde, Bart | |
| dc.contributor.author | Vernhes, Pierre | |
| dc.contributor.author | Cruz, Rodolfo | |
| dc.contributor.imecauthor | Nawghane, Chinmay | |
| dc.contributor.imecauthor | Vandevelde, Bart | |
| dc.contributor.orcidimec | Nawghane, Chinmay::0000-0002-1867-827X | |
| dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
| dc.date.accessioned | 2023-11-21T08:50:48Z | |
| dc.date.available | 2023-10-15T17:21:18Z | |
| dc.date.available | 2023-11-21T08:50:48Z | |
| dc.date.issued | 2023 | |
| dc.identifier.doi | 10.1109/EuroSimE56861.2023.10100821 | |
| dc.identifier.eisbn | 979-8-3503-4597-1 | |
| dc.identifier.issn | 2833-8553 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/42751 | |
| dc.publisher | IEEE | |
| dc.source.conference | 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) | |
| dc.source.conferencedate | APR 16-19, 2023 | |
| dc.source.conferencelocation | Graz | |
| dc.source.journal | na | |
| dc.source.numberofpages | 8 | |
| dc.title | Deformation analysis of QFN packages for validation of thermo-mechanical finite element simulations | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
| Publication available in collections: |