Through-silicon via technology for three-dimensional integrated circuit manufacturing

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Author(s)

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Redolfi, Augusto

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Jaenen, Patrick

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Kostermans, Maarten

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Van Besien, Els

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Witters, Thomas

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Jourdan, Nicolas

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Vandersmissen, Kevin

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Philipsen, Harold

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Verdonck, Patrick

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Nolmans, Philip

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Metrics

1870 since deposited on 2021-10-20

Acq. date: 2025-10-23