Publication:
A new generic surface micromachining module for MEMS hermetic packaging at temperatures below 200° C
Date
| dc.contributor.author | Hellin Rico, Raquel | |
| dc.contributor.author | Celis, Jean-Pierre | |
| dc.contributor.author | Baert, Kris | |
| dc.contributor.author | Van Hoof, Chris | |
| dc.contributor.author | Witvrouw, Ann | |
| dc.contributor.imecauthor | Van Hoof, Chris | |
| dc.contributor.orcidimec | Van Hoof, Chris::0000-0002-4645-3326 | |
| dc.date.accessioned | 2021-10-16T16:32:59Z | |
| dc.date.available | 2021-10-16T16:32:59Z | |
| dc.date.issued | 2007 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/12265 | |
| dc.source.beginpage | 1451 | |
| dc.source.endpage | 1456 | |
| dc.source.issue | 11_12 | |
| dc.source.journal | Microsystem Technologies | |
| dc.source.volume | 13 | |
| dc.title | A new generic surface micromachining module for MEMS hermetic packaging at temperatures below 200° C | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | ||
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