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Design-oriented measurement-based scaleable models for multilayer MCM-D integrated passives. Implementation in a design library offering automated layout

Date

2000
Proceedings Paper
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dc.contributor.authorCarchon, Geert
dc.contributor.authorPieters, Philip
dc.contributor.authorVaesen, Kristof
dc.contributor.authorBrebels, Steven
dc.contributor.authorSchreurs, Dominique
dc.contributor.authorVandenberghe, S.
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorNauwelaers, Bart
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorPieters, Philip
dc.contributor.imecauthorVaesen, Kristof
dc.contributor.imecauthorBrebels, Steven
dc.contributor.imecauthorSchreurs, Dominique
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorNauwelaers, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVaesen, Kristof::0000-0001-9971-3593
dc.contributor.orcidimecBrebels, Steven::0000-0002-1568-0286
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-14T12:43:16Z
dc.date.available2021-10-14T12:43:16Z
dc.date.embargo9999-12-31
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4175
dc.source.beginpage196
dc.source.conferenceInternational Conference and Exhibition on High Density Interconnect and Systems Packaging - HDI
dc.source.conferencedate24/04/2000
dc.source.conferencelocationDenver, CO USA
dc.source.endpage201
dc.title

Design-oriented measurement-based scaleable models for multilayer MCM-D integrated passives. Implementation in a design library offering automated layout

dc.typeProceedings paper
dspace.entity.typePublication
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