Publication:
Extreme Wafer Thinning and nano-TSV processing for 3D Heterogeneous Integration
| dc.contributor.author | Jourdain, Anne | |
| dc.contributor.author | Schleicher, Filip | |
| dc.contributor.author | De Vos, Joeri | |
| dc.contributor.author | Stucchi, Michele | |
| dc.contributor.author | Chery, Emmanuel | |
| dc.contributor.author | Miller, Andy | |
| dc.contributor.author | Beyer, Gerald | |
| dc.contributor.author | Van der Plas, Geert | |
| dc.contributor.author | Walsby, Edward | |
| dc.contributor.author | Roberts, Kerry | |
| dc.contributor.author | Ashraf, Huma | |
| dc.contributor.author | Thomas, Dave | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Jourdain, Anne | |
| dc.contributor.imecauthor | Schleicher, Filip | |
| dc.contributor.imecauthor | De Vos, Joeri | |
| dc.contributor.imecauthor | Stucchi, Michele | |
| dc.contributor.imecauthor | Chery, Emmanuel | |
| dc.contributor.imecauthor | Miller, Andy | |
| dc.contributor.imecauthor | Beyer, Gerald | |
| dc.contributor.imecauthor | Van der Plas, Geert | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Schleicher, Filip::0000-0003-3630-7285 | |
| dc.contributor.orcidimec | Chery, Emmanuel::0000-0002-2526-3873 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.contributor.orcidimec | De Vos, Joeri::0000-0002-9332-9336 | |
| dc.contributor.orcidimec | Van der Plas, Geert::0000-0002-4975-6672 | |
| dc.date.accessioned | 2022-01-10T11:54:25Z | |
| dc.date.available | 2021-11-02T16:04:30Z | |
| dc.date.available | 2022-01-10T11:54:25Z | |
| dc.date.issued | 2020 | |
| dc.identifier.doi | 10.1109/ECTC32862.2020.00020 | |
| dc.identifier.eisbn | 978-1-7281-6180-8 | |
| dc.identifier.issn | 0569-5503 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/38145 | |
| dc.publisher | IEEE COMPUTER SOC | |
| dc.source.beginpage | 42 | |
| dc.source.conference | 70th IEEE Electronic Components and Technology Conference (ECTC) | |
| dc.source.conferencedate | JUN 03-30, 2020 | |
| dc.source.conferencelocation | Virtual | |
| dc.source.endpage | 48 | |
| dc.source.journal | na | |
| dc.source.numberofpages | 7 | |
| dc.title | Extreme Wafer Thinning and nano-TSV processing for 3D Heterogeneous Integration | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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