Numerical simulation of nano-indentation induced fracture of low-k dielectric thin films using cube corner indenter

dc.contributor.author	Zahedmanesh, Houman
dc.contributor.author	Vanstreels, Kris
dc.contributor.author	Gonzalez, Mario
dc.contributor.imecauthor	Zahedmanesh, Houman
dc.contributor.imecauthor	Vanstreels, Kris
dc.contributor.imecauthor	Gonzalez, Mario
dc.contributor.orcidimec	Vanstreels, Kris::0000-0002-4420-0966
dc.date.accessioned	2021-10-23T01:27:19Z
dc.date.available	2021-10-23T01:27:19Z
dc.date.embargo	9999-12-31
dc.date.issued	2015
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/26227
dc.identifier.url	http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7325630
dc.source.beginpage	75
dc.source.conference	IEEE International Interconnect Technology Conference - IITC / Materials for Advanced Metallization Conference - MAM
dc.source.conferencedate	18/05/2015
dc.source.conferencelocation	Grenoble France
dc.source.endpage	78
dc.title	Numerical simulation of nano-indentation induced fracture of low-k dielectric thin films using cube corner indenter
dc.type	Proceedings paper
dspace.entity.type	Publication
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