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Processing quality results for electroless/electroplating of high-aspect ratio plated through holes in industrially produced printed circuit boards
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Processing quality results for electroless/electroplating of high-aspect ratio plated through holes in industrially produced printed circuit boards
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Date
2004
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Siau, S.
;
De Baets, Johan
;
Van Calster, Andre
;
Heremans, L.
;
Tanghe, S.
Journal
Microelectronic Reliability
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1869
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Acq. date: 2025-12-17
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Metrics
Views
1869
since deposited on 2021-10-15
1
last month
1
last week
Acq. date: 2025-12-17
Citations