Publication:
Electrical, thermal and mechanical impact of 3D TSV and 3D stacking technology on advanced CMOS devices – Technology directions
Date
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-20T10:05:58Z | |
| dc.date.available | 2021-10-20T10:05:58Z | |
| dc.date.issued | 2012 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/20360 | |
| dc.identifier.url | http://ieeexplore.ieee.org/document/6262977/?arnumber=6262977 | |
| dc.source.beginpage | 1 | |
| dc.source.conference | 2011 IEEE International 3D Systems Integration Conference - 3DIC | |
| dc.source.conferencedate | 31/01/2012 | |
| dc.source.conferencelocation | Osaka Japan | |
| dc.source.endpage | 6 | |
| dc.title | Electrical, thermal and mechanical impact of 3D TSV and 3D stacking technology on advanced CMOS devices – Technology directions | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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