Publication:
Process characterization and reliability issues of three dimension-stacked integrated circuit (3D-SIC) structures
Date
| dc.contributor.author | Yang, Yu | |
| dc.contributor.thesisadvisor | Verlinden, Albert | |
| dc.contributor.thesisadvisor | Van Hoof, Chris | |
| dc.date.accessioned | 2021-10-19T00:41:12Z | |
| dc.date.available | 2021-10-19T00:41:12Z | |
| dc.date.embargo | 9999-12-31 | |
| dc.date.issued | 2010-11 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/18380 | |
| dc.title | Process characterization and reliability issues of three dimension-stacked integrated circuit (3D-SIC) structures | |
| dc.type | PHD thesis | |
| dspace.entity.type | Publication | |
| Files | Original bundle
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| Publication available in collections: |