Publication:
Wafer scale copper direct plating on thin PVD RuTa layers: a route to enable filling 30 nm features and below?
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1892 since deposited on 2021-10-22
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Acq. date: 2026-03-16
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Statistics
Views
1892 since deposited on 2021-10-22
1last month
1last week
Acq. date: 2026-03-16
Citations