Publication:
Wafer scale copper direct plating on thin PVD RuTa layers: a route to enable filling 30 nm features and below?
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1891 since deposited on 2021-10-22
Acq. date: 2026-02-24
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Statistics
Views
1891 since deposited on 2021-10-22
Acq. date: 2026-02-24
Citations